Unsurprisingly, the summer lineup of the Japanese carrier NTT Docomo includes the high-profile Samsung Galaxy S III. What caught our eye, however, is that the Japanese version makes use of a dual-core Qualcomm’s Snapdragon 1.5GHz processor (MSM8960) much like the LTE-equipped HTC One Xfor AT&T US and the One XL.
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Unfortunately, the change in chipset has brought about a change in thickness as well. The Galaxy S III (SC-06D) is 9mm thick instead of 8.6mm. It's not a big deal, but it's the sub-9mm thickness (among other things) that sets apart the latest batch of high end smartphones such as the international S III, theHTC One X, or the Optimus 4X HD.
The other specs of the Samsung flagship remain the same - the 4.8-inch HD AMOLED screen, the 8 megapixel camera, the microSD slot, the 2100mAh battery and even the color options - Pebble blue and Marble white.
While the news about a Japanese-only model might not be that exciting, it allows us a sneak peak of what Samsung is preparing for the North American market, where LTE connectivity is a must for a high-end smartphone. So far Samsung has not revealed detailed specs for a US model, so we've been in the dark as to what to expect on that front even though recent evidence suggested Verizon's Galaxy S III will come with the same Snapdragon chipset.
Fear not, our latest benchmarks on the US-spec'd One X show that the dual-core Snapdragon is a nice match for the quad-core Exynos.
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